出展のみどころ
Competence:
- New materials / Ceramics / Sintering technologies
- Adhesive technology with multifunctional secundary effect
- Chiplets; - Laserbonding, Inspection
- Low-energy nanotransistors; - Pressure sensor technology
- All-industry testing services, environmental testing
- Synergy/Intersection: Microelectronics / Photonics
- Qualification of spezialised staf; - Alliances
Applications:
- Microsystems technology and sensor technology for hydrogen
- Advanced Packaging, Printed Circuit Boards
- Microintegration, SiP; - Reliable Electronics, SMD
- Laser shaping, Drilling, Cutting, Trimming
- Digitisation in agriculture and forestry - intersection agriculture
and forestry
- Special purpose machinery manufacture, Equipment
- Microelectronics, Photovoltaics
- New Energies (e. g.: H2 -production, -transport, -storage)
Network partners:
- AUCOTEAM GmbH, Berlin
- Brandenburgische Technische Universität, Cottbus - Senftenberg (BTU)
- BOS TECHNOLOGY GmbH, Berlin; - budatec GmbH, Berlin
- DiKuLi Consulting, Müllrose
- Eberswalde University for Sustainable Development (HNE Eberswalde)
- MATRIX – Institut for applied Research UG, Frankfurt (Oder)
- INSENSO GmbH, Berlin
- Pac Tech - Packaging Technologies GmbH, Nauen
- Photonics Systems Group, Berlin
- PRIGNITZ Microsystems technology GmbH, Wittenberge
- Bindfadenhaus en gros Gustav Scharnau GmbH, Werneuchen
- Swissbit Germany AG, Berlin
- University for Technology and Economy Berlin (HTW Berlin)
- IHP GmbH – Innovations for High Performance Microelectronics /
Leibniz-Institut for innovative Microelectronics, Frankfurt (Oder)
- City Frankfurt (Oder)
